a global leader in microelectronic test, today announced it will discuss results of extensive research in high-density wafer probe technology at three upcoming test conferences this fall targeted at 3D device testing. The results show that evolutionary scaling of Cascade Microtech's Pyramid Probe® technology can achieve the mechanical, electrical, and economic requirements of probing fine-pitch through-silicon vias (TSVs) for known-good die (KGD) sorting of 3D chips before stacking.
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